iRel4.0 - Intelligent Reliability 4.0

Programme
H2020-ECSEL-2019-1-IA
Project Number
876659-2
Budget
Total Budget: €103.6M / EU Contribution: €25M
Duration
36 months
Project Status
Grant Agreement pending

Summary

Electronic components and systems are key enablers for various applications affecting our daily life areas. Moreover, they are the innovation drivers for the development of technologies, products and systems. This development is enabled and based on the results of improved reliability. Reliability is enhanced by manufacturing excellence, advanced reliability testing methods and robustness validation to verify the quality and reliability requirements needed in different application domains. Hence, to understand physical failures and defect dynamics is of utmost importance for enhancing reliability and has to be considered along the whole value chain from chip, package to board to system. Reliability has a significant impact on the entire ECS industry and all its applications. Consequently, all ECS value chain partners - material suppliers, chip manufacturers, board and system integrators, Tier I and Tier II as well as OEMs are focusing on improving reliability to satisfy the end customer. The project iRel4.0 influences various aspects of the MASP - Transport and Smart Mobility, Digital Industry, education and healthcare systems, communication, energy sector, production as well as sales and marketing.

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Consortium

iRel4.0 has a consortium of 79 partners from 14 countries.

Contribution of MInD-NET (Marmara University)

Information will be added soon.